Volume 44; Issue 12

Microelectronics Reliability

Volume 44; Issue 12

1

Multi-physics modeling in virtual prototyping of electronic packages––combined thermal, thermo-mechanical and vapor pressure modeling

X.J. Fan, J. Zhou, G.Q. Zhang

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 598 KB

english, 2004

2

Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages

Tong Yan Tee, Zhaowei Zhong

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 528 KB

english, 2004

3

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

W.D. van Driel, C.J. Liu, G.Q. Zhang, J.H.J. Janssen, R.B.R. van Silfhout, M.A.J. van Gils, L.J. Ernst

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 651 KB

english, 2004

4

Prediction of thermo-mechanical integrity of wafer backend processes

V. Gonda, J.M.J. Den Toonder, J. Beijer, G.Q. Zhang, W.D. van Driel, R.J.O.M. Hoofman, L.J. Ernst

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 426 KB

english, 2004

5

CMOS Telecom Data converters; Angel Rodriguez-Vazquez, Fernando Medeiro, Edmond Janssens, editors. Kluwer Academic Publishers, Boston; 2003. Hardcover, 588pp, plus XXXIII, 128 euro. ISBN 1-4020-7546-4

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 217 KB

english, 2004

6

Design and control of RF power amplifier; Alireza Shirvani, Bruce Wooley. Kluwer Academic Publishers, Boston; 2003. Hardcover, pp. 149, plus XVI, 127 euro. ISBN 1-4020-7562-6

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 211 KB

english, 2004

7

Low-voltage CMOS log companding analog design; Francisco Sera-Graells, Andoracion Rueda, Jose L. Huertas. Kluwer Academic Publishers, Boston; 2003. Hardcover, pp. 192, plus XXV, 117 euro. ISBN 1-4020-7445-X

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 211 KB

english, 2004

8

Package and solder joint reliability analysed by FEM simulation and experiments

Bart Vandevelde, Dag Andersson

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 212 KB

english, 2004

9

Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders

S. Wiese, K.-J. Wolter

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 807 KB

english, 2004

10

Parametric FE-approach to flip-chip reliability under various loading conditions

B. Wunderle, W. Nüchter, A. Schubert, B. Michel, H. Reichl

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 770 KB

english, 2004

11

Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach

D.G. Yang, J.S. Liang, Q.Y. Li, L.J. Ernst, G.Q. Zhang

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 875 KB

english, 2004

12

Residual stresses in microelectronics induced by thermoset packaging materials during cure

Marcel H.H. Meuwissen, Hedzer A. de Boer, Henk L.A.H. Steijvers, Piet J.G. Schreurs, Marc G.D. Geers

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 469 KB

english, 2004

13

Contents of Volume 44

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 269 KB

english, 2004

14

Author index for Volume 44

Journal:

Microelectronics Reliability

Année:

2004

Fichier:

PDF, 214 KB

2004

15

Time-independent elastic–plastic behaviour of solder materials

S. Wiese, S. Rzepka

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 642 KB

english, 2004

16

Morphology changes in solder joints––experimental evidence and physical understanding

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 1.50 MB

english, 2004

17

Characterization and FE analysis on the shear test of electronic materials

M. Gonzalez, B. Vandevelde, R. Van Hoof, E. Beyne

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 463 KB

english, 2004

18

A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending

Leon Xu, Tommi Reinikainen, Wei Ren, Bo Ping Wang, Zhenxue Han, Dereje Agonafer

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 299 KB

english, 2004

19

Finite element simulation of package stress in transfer molded MEMS pressure sensors

Rudolf Krondorfer, Yeong K. Kim, Jaeok Kim, Claes-Gøran Gustafson, Timothy C. Lommasson

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 600 KB

english, 2004

20

Prediction of crack growth in IC passivation layers

Y.T. He, M.A.J. van Gils, W.D. van Driel, G.Q. Zhang, R.B.R. van Silfhout, L.J. Ernst

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 403 KB

english, 2004