Volume 38; Issue 2

Journal of Electronic Materials

Volume 38; Issue 2

1

Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders

M.A. Dudek, N. Chawla

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 1.01 MB

english, 2009

2

An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate

Sun-Kyoung Seo, Sung K. Kang, Da-Yuan Shih, Hyuck Mo Lee

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 649 KB

english, 2009

3

Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders

Seongjun Kim, Keun-Soo Kim, Sun-Sik Kim, Katsuaki Suganuma

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 779 KB

english, 2009

4

Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications

Riko I Made, Chee Lip Gan, Li Ling Yan, Aibin Yu, Seung Wook Yoon, John H. Lau, Chengkuo Lee

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 442 KB

english, 2009

5

Temperature-Dependent Phase Segregation in Cu/42Sn-58Bi/Cu Reaction Couples under High Current Density

Guangchen Xu, Hongwen He, Fu Guo

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 1.17 MB

english, 2009

6

Nature of Growth Pits in Lead Salt Epilayers Grown by Molecular Beam Epitaxy

Jiangang Ma, Donghui Li, Gang Bi, Fanghai Zhao, Shelly Elizondo, Shaibal Mukherjee, Zhisheng Shi

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 246 KB

english, 2009

7

The Effects of Solid-State Aging on the Intermetallic Compounds of Sn-Ag-Bi-In Solders on Cu Substrates

Albert T. Wu, Ming-Hsun Chen, Ciou-Nan Siao

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 297 KB

english, 2009

8

The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder

Christopher Kinney, J.W. Morris, Tae-Kyu Lee, Kuo-Chuan Liu, Jie Xue, Dave Towne

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 299 KB

english, 2009

9

Foreword

Fu Guo, Carol A. Handwerker, Srinivas Chada, Fay Hua, Kejun Zeng

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 54 KB

english, 2009

10

Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy

R. Mahmudi, A.R. Geranmayeh, H. Noori, M. Taghaddosi

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 595 KB

english, 2009

11

Interfacial Reaction Between Eutectic Sn-Pb Solder and Electroplated-Ni as well as Electroless-Ni Metallization During Reflow

Hsiao-Yun Chen, Chih Chen

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 673 KB

english, 2009

12

Morphology and Growth of Intermetallics at the Interface of Sn-based Solders and Cu with Different Surface Finishes

Ruihong Zhang, Fu Guo, Jianping Liu, Hao Shen, Feng Tai

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 1.08 MB

english, 2009

13

Oxidation of Lead Frame Copper Alloys with Different Compositions and Its Effect on Oxide Film Adhesion

Xi Chen, Anmin Hu, Ming Li, Dali Mao

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 383 KB

english, 2009

14

Effects of Thermal Aging on Microstructure and Microhardness of Sn-3.7Ag-0.9Zn-1In Solder

Chen Wei, Yongchang Liu, Zhiming Gao, Jingbo Wan, Changsheng Ma

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 492 KB

english, 2009

15

Structural, Elastic, and Electronic Properties of Al-Cu Intermetallics from First-Principles Calculations

Wei Zhou, Lijuan Liu, Baoling Li, Qinggong Song, Ping Wu

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 661 KB

english, 2009

16

Specific Heat Capacities of Sn-Zn-Based Solders and Sn-Ag-Cu Solders Measured Using Differential Scanning Calorimetry

Y.K. Wu, K.L. Lin, B. Salam

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 300 KB

english, 2009

17

Wetting Kinetics of Eutectic Lead and Lead-Free Solders: Spreading over the Cu Surface

Hui Zhao, Dinesh Reddy Nalagatla, Dusan P. Sekulic

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 690 KB

english, 2009

18

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

Chang Dong Zou, Yu Lai Gao, Bin Yang, Xin Zhi Xia, Qi Jie Zhai, Cristina Andersson, Johan Liu

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 279 KB

english, 2009

19

Microstructure, Defects, and Reliability of Mixed Pb-Free/Sn-Pb Assemblies

Polina Snugovsky, Heather McCormick, Simin Bagheri, Zohreh Bagheri, Craig Hamilton, Marianne Romansky

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 807 KB

english, 2009

20

Anisotropic Crystal Plasticity Finite Element Modeling of the Effect of Crystal Orientation and Solder Joint Geometry on Deformation after Temperature Change

A. Zamiri, T.R. Bieler, F. Pourboghrat

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 855 KB

english, 2009

21

Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature Storage

J. Osenbach, A. Amin, M. Bachman, F. Baiocchi, D. Bitting, D. Crouthamel, J. DeLucca, D. Gerlach, J. Goodell, C. Peridier, M. Stahley, R. Weachock

Journal:

Journal of Electronic Materials

Année:

2009

Langue:

english

Fichier:

PDF, 1.44 MB

english, 2009