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Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders
Seongjun Kim, Keun-Soo Kim, Sun-Sik Kim, Katsuaki SuganumaVolume:
38
Langue:
english
Pages:
7
DOI:
10.1007/s11664-008-0550-0
Date:
February, 2009
Fichier:
PDF, 779 KB
english, 2009