88

Wet etching characteristics of a HfSiON high- k dielectric in HF-based solutions

Année:
2010
Langue:
english
Fichier:
PDF, 1.01 MB
english, 2010
89

TaN wet etch for application in dual-metal-gate integration technology

Année:
2009
Langue:
english
Fichier:
PDF, 1.01 MB
english, 2009
93

Two-step Ni silicide process and influence of protective N 2 gas

Année:
2009
Langue:
english
Fichier:
PDF, 631 KB
english, 2009
94

Adjustment of NiSi/n-Si SBH by post-silicide of dopant segregation process

Année:
2009
Langue:
english
Fichier:
PDF, 217 KB
english, 2009
96

SBH adjustment characteristic of the dopant segregation process for NiSi/n-Si SJDs

Année:
2010
Langue:
english
Fichier:
PDF, 603 KB
english, 2010
100

Thermal stability of HfTaON films prepared by physical vapor deposition

Année:
2009
Langue:
english
Fichier:
PDF, 311 KB
english, 2009