IEEE Transactions on Electronics Packaging Manufacturing

1

Reliable Lead-Free Rework Process for Stacked CSP Components

Iyer, S., Srihari, K.

Journal:

Année:

2009

Langue:

english

Fichier:

PDF, 858 KB

english, 2009

2

Constitutive and Aging Behavior of Sn3.0Ag0.5Cu Solder Alloy

Mysore, K., Subbarayan, G., Gupta, V., Ron Zhang

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Année:

2009

Langue:

english

Fichier:

PDF, 1.29 MB

english, 2009

3

Effects of Defects on the Thermal and Optical Performance of High-Brightness Light-Emitting Diodes

Liuxi Tan, Jia Li, Kai Wang, Sheng Liu

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Année:

2009

Langue:

english

Fichier:

PDF, 1.39 MB

english, 2009

4

Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection

Kiwon Lee, Hyoung-Joon Kim, Myung-Jin Yim, Kyung-Wook Paik

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Année:

2009

Langue:

english

Fichier:

PDF, 2.12 MB

english, 2009

5

Experimental Evaluations of the Strength of Silicon Die by 3-Point-Bend Versus Ball-on-Ring Tests

Jie-Hua Zhao, Tellkamp, J., Gupta, V., Edwards, D.R.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Année:

2009

Langue:

english

Fichier:

PDF, 1.52 MB

english, 2009

6

Flexible Electronics: Thin Silicon Die on Flexible Substrates

Tan Zhang, Zhenwei Hou, Johnson, R.W., Del Castillo, L., Moussessian, A., Greenwell, R., Blalock, B.J.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Année:

2009

Langue:

english

Fichier:

PDF, 1.97 MB

english, 2009

7

Optimizing SMT Performance Using Comparisons of Efficiency Between Different Systems Technique in DEA

Al-Refaie, A.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Année:

2009

Langue:

english

Fichier:

PDF, 1.02 MB

english, 2009

8

Cross-Section Preparation for Solder Joints and MEMS Device Using Argon Ion Beam Milling

Amirmajdi, O.M., Ashyer-Soltani, R., Clode, M.P., Mannan, S.H., Yunqi Wang, Cabruja, E., Pellegrini, G.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Année:

2009

Langue:

english

Fichier:

PDF, 4.53 MB

english, 2009

9

Effect of Lead-Free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates

Sanapala, R., Sood, B., Das, D., Pecht, M.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Année:

2009

Langue:

english

Fichier:

PDF, 1015 KB

english, 2009

10

Chemical and Mechanical Analysis of PCB Surface Treated by Argon Plasma to Enhance Interfacial Adhesion

Dong Kil Shin, Hyo Sug Lee, Im, J.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Année:

2009

Langue:

english

Fichier:

PDF, 1.64 MB

english, 2009

11

Thermal-Mechanical Process Simulation of an Advanced NCF Technology

Hsien-Chie Cheng, Wan-Yu Hwang, Kuo Shu Kao, Tsang, J., Yang, S.S., Chao-Chyun An, Chang, S.M.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Année:

2009

Langue:

english

Fichier:

PDF, 1.34 MB

english, 2009

12

Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Lead-free Packaging Architectures Under Shock and Vibration

Lall, P., Iyengar, D., Shantaram, S., Pandher, R., Panchagade, D.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Année:

2009

Langue:

english

Fichier:

PDF, 3.08 MB

english, 2009

13

List of Reviewers

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Année:

2009

Langue:

english

Fichier:

PDF, 20 KB

english, 2009

14