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Volume 226

MRS Proceedings

Volume 226
1

Continuous Wetiability Measurement for Solder Reflow

Melton, Cynthia M., Yarling, Susan M., Raleigh, Carl J.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 427 KB
english, 1991
2

Finite Element Simulation of Hillock Formation in Aluminum Interconnect

Burrell, L. G., Kapur, S., Shareef, I.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 211 KB
english, 1991
4

The Interplay of Thermo-Mechanical Properties in the Growth and Processing of III-V Materials

Jordan, A. S., Swaminathan, V.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 668 KB
english, 1991
5

The Effects of Stress on the Interdiffusion in Si1-xGex/Si Superlattices

Prokes, S.M.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 513 KB
english, 1991
6

Experimental Evaluation of Mechanical Behavior of GaAs Wafer Material

Hu, Jun Ming, Pecht, Michael, Barker, Donald
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 351 KB
english, 1991
8

Presence of Anelastic Strains in High Lead Solders at Ambient and High Temperatures

Tien, J.K., Attarwala, A.I.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 385 KB
english, 1991
10

The AC-Indentation Technique and its Application to Al and Al-Si Coatings

Wu, T.W.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 894 KB
english, 1991
11

New Developments in the Dynamic Mechanical Analysis of Thin-Layer Materials

Berry, B.S., Pritchet, W.C.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 611 KB
english, 1991
12

On The Electronic Contribution to Elastic Constants of Ultrathin Films of P-Type Si

Ghatak, Kamaxhya P, De, Badal
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 207 KB
english, 1991
13

Stress in Metal Foils During Processing and Thermal Cycling.

Jagota, A., Lemon, M.F., Hu, Y.H.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 1.01 MB
english, 1991
14

Microstructure and Mechanical Behavior of Magnetron Sputtered Al-Cu Films

Lin, Tsann, Raman, V.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 2.56 MB
english, 1991
16

Mechanical Behavior of Benzocyclobutene Films on Silicon Substrates

Townsend, P. H., Stokich, T. M., Huber, B. S.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 440 KB
english, 1991
17

Microhardness of Thin SIO2 Films On Silicon.

Yost, B., Li, Che-Yu, Bergman-Reuter, Bette, Sullivan, Tim
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 276 KB
english, 1991
19

Laser Ultrasonic Measurement of Thin Film Elastic Properties

Bobbin, Sarah E., Wagner, J. W., Cammarata, R. C.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 233 KB
english, 1991
20

Control of Microstructure and Stress in Sputtered Tungsten Thin Films on Silicon

Kola, R.R., Celler, G.K.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 2.05 MB
english, 1991
22

Preparation of TI-Ba-Ca-Cu Superconducting Oxide Films by Spray Pyrolysis Technique

Koo, H.S., Kuo, T.L., Kuo, D.H., Lin, R.J., Lee, W.H., Wu, P.T.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 1.08 MB
english, 1991
23

Relaxation of Thermal Stresses in Al-Films

Bohn, H.G., Pill, W., Robrock, K.-H, Schilling, W.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 322 KB
english, 1991
24

Stress and Resistivity in Reactively Sputtered Amorphous Metallic Ta-Si-N Films

Kwok, C.-K., Kolawa, E., Nicolet, M-A., Lee, Ray C.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 281 KB
english, 1991
26

Strains and Relaxations Near metal Alumlnide/Semiconductor Interfaces

Gerberich, W.W., Angelo, J.E., Keller, R.R., Wowchak, A.M., Cohen, P.I.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 6.24 MB
english, 1991
28

Isothermal Fatigue of 62Sn–36Pb–2Ag Solder

Vaynhan, Semyon, Fine, Morris E.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 1.20 MB
english, 1991
29

Fracture Strength of A1203 Insulating Thin Film for High Density Wiring Substrate

Jono, Masahiro, Sugeta, Atsushi
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 2.95 MB
english, 1991
30

Aging and Fracture Behavior of Polymers

Chudnovsky, A., Bosnyak, C.P.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 2.66 MB
english, 1991
31

A Micromechanical Analysis of the Signal Propagation in Composite Materials

Chen, C. S.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 164 KB
english, 1991
32

Thermal Expansion Model for Multiphase Electronic Packaging Materials

Allred, Ronald E., Warren, William E.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 404 KB
english, 1991
33

Curvature Measurements of Tri-Material Structures Under Thermal Excursion

Lu, Guo-Quan, Mogilevsky, Boris, Gupta, Tapan K.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 300 KB
english, 1991
37

Fracture Behavior of Silicon Cut with a High Power Laser

Chao, C.C., Chleboski, R., Henderson, E.J., Holmes, C.K., Kalejs, J.P., Gross, T.S.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 1.83 MB
english, 1991
38

A New Approach to Evaluate the Delayed Fracture Behavior of an Optical Glass Fiber

Muraoka, M., AbÉ, H.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 831 KB
english, 1991
39

Numerical Simulation & Experimental Investigation of SMT Laser Microsoldering Thermal Process

Chunqing, Wang, Yiyu, Qian, Yihong, Jiang
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 230 KB
english, 1991
41

Testing of Fracture Resistance of Materials

Ni, Beta Y., Zhang, T. Y., Li, J. C. M.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 729 KB
english, 1991
43

Stress Induced Void Nucleation in Narrow Aluminum Alloy Lines

Børgesen, P., Korhonen, M. A., Basa, C., Lafontaine, W. R., Land, B., Li, C.-Y.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 1004 KB
english, 1991
44

The Effect of Line Geometry on Void Growth in Thin, Narrow Aluminum Lines

Borgesen, P., Lee, J. K., Korhonen, M. A., Li, C.-Y.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 340 KB
english, 1991
48

A Comparison of the Metallurgical Behavior of Gold and Copper Wires in Ball Bonding

Uno, Tomohiro, Tatsumi, K., Mizuno, K., Kitamura, O., Ohno, Y.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 1.98 MB
english, 1991
49

Creep-Fatigue Behavior of Microelectronic Solder Joints

Ross, R.G., Wen, L.C., Mon, G.R., Jetter, E., Winslow, J.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 2.07 MB
english, 1991
51

Numerical Analysis of the Bali. Forming Process in Copper Ball Bonding

Iiongyuan, Fang, Yiyu, Oian, Yihong, Jiang
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 1.20 MB
english, 1991
52

Mechanical Behavior of Encapsulants in Microelectronic Packaging

Wong, C.P.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 2.55 MB
english, 1991
53

Thermal Modeling of Plastic Ic Packages

Bar-Cohen, A., Mix, Devin E.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 885 KB
english, 1991
54

Elastomeric Conductors for Electrical Contacts

Zhu, Mingguang, Chung, D.D.L.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 364 KB
english, 1991
56

A Methodology for Reliability Assessment of Non-Ductile Encapsulants

Wong, Boon, Sandkulla, David C.
Journal:
MRS Proceedings
Année:
1991
Langue:
english
Fichier:
PDF, 496 KB
english, 1991