Volume 17; Issue 4

Microsystem Technologies

Volume 17; Issue 4
2

Hot embossing of high performance polymers

Année:
2011
Langue:
english
Fichier:
PDF, 562 KB
english, 2011
6

A novel chip-on-glass method for slim LCD packaging

Année:
2011
Langue:
english
Fichier:
PDF, 1.45 MB
english, 2011
8

A piezoelectric energy harvester with a mechanical end stop on one side

Année:
2011
Langue:
english
Fichier:
PDF, 575 KB
english, 2011
12

Structure modification of M-AFM probe for the measurement of local conductivity

Année:
2011
Langue:
english
Fichier:
PDF, 488 KB
english, 2011
13

Parametric study of flip-chip packaging for an MEMS device with diaphragm

Année:
2011
Langue:
english
Fichier:
PDF, 587 KB
english, 2011
18

Investigation of parallel heat flow path in electro-thermal microsystems

Année:
2011
Langue:
english
Fichier:
PDF, 468 KB
english, 2011
26

Simulation of maximum power in the wearable thermoelectric generator with a small thermopile

Année:
2011
Langue:
english
Fichier:
PDF, 525 KB
english, 2011