Volume 49; Issue 3

Microelectronics Reliability

Volume 49; Issue 3
3

Research advances in nano-composite solders

Année:
2009
Langue:
english
Fichier:
PDF, 477 KB
english, 2009
4

Towards elastic anisotropy and strain-induced void formation in Cu–Sn crystalline phases

Année:
2009
Langue:
english
Fichier:
PDF, 404 KB
english, 2009
5

Solder-joint reliability of HVQFN-packages subjected to thermal cycling

Année:
2009
Langue:
english
Fichier:
PDF, 1.42 MB
english, 2009
6

Development of gold based solder candidates for flip chip assembly

Année:
2009
Langue:
english
Fichier:
PDF, 838 KB
english, 2009
7

Interfacial fracture toughness of Pb-free solders

Année:
2009
Langue:
english
Fichier:
PDF, 2.36 MB
english, 2009
10

Recent research advances in Pb-free solders

Année:
2009
Langue:
english
Fichier:
PDF, 99 KB
english, 2009
14

Investigation of delamination control in plastic package

Année:
2009
Langue:
english
Fichier:
PDF, 2.13 MB
english, 2009
17

Inside front cover - Editorial board

Année:
2009
Langue:
english
Fichier:
PDF, 42 KB
english, 2009