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Volume 21; Issue 3

IEEE Transactions on Semiconductor Manufacturing

Volume 21; Issue 3
1

Product Yield Prediction System and Critical Area Database

Barnett, T.S., Bickford, J.P., Weger, A.J.
Journal:
IEEE Transactions on Semiconductor Manufacturing
Année:
2008
Langue:
english
Fichier:
PDF, 639 KB
english, 2008
2

Study on the Mechanical Properties of CMP Pads

Bum Soo Kim,, Tucker, M.H., Kelchner, J.D., Beaudoin, S.P.
Journal:
IEEE Transactions on Semiconductor Manufacturing
Année:
2008
Langue:
english
Fichier:
PDF, 1.15 MB
english, 2008
4

Measuring Power Distribution System Resistance Variations

Helinski, R., Plusquellic, J.
Journal:
IEEE Transactions on Semiconductor Manufacturing
Année:
2008
Langue:
english
Fichier:
PDF, 1.30 MB
english, 2008
12

Treatment of Copper from Cu CMP Waste Streams Using Polyethyleneimine

Maketon, W.K., Ogden, K.L.
Journal:
IEEE Transactions on Semiconductor Manufacturing
Année:
2008
Langue:
english
Fichier:
PDF, 468 KB
english, 2008
13

Integrated Planning of Production and Engineering Process Improvement

Sukgon Kim,, Uzsoy, R.M.
Journal:
IEEE Transactions on Semiconductor Manufacturing
Année:
2008
Langue:
english
Fichier:
PDF, 722 KB
english, 2008
19

Last Metal Copper Metallization for Power Devices

Robl, W., Melzl, M., Weidgans, B., Hofmann, R., Stecher, M.
Journal:
IEEE Transactions on Semiconductor Manufacturing
Année:
2008
Langue:
english
Fichier:
PDF, 1.03 MB
english, 2008
20

A Multiscale Bayesian SPRT Approach for Online Process Monitoring

Ganesan, R., Rao, A.N.V., Das, T.K.
Journal:
IEEE Transactions on Semiconductor Manufacturing
Année:
2008
Langue:
english
Fichier:
PDF, 806 KB
english, 2008
22

Changes in the Editorial Board

Boning, Duane S.
Journal:
IEEE Transactions on Semiconductor Manufacturing
Année:
2008
Langue:
english
Fichier:
PDF, 220 KB
english, 2008