Volume 25; Issue 3

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Circuit World
Volume 25; Issue 3

Circuit World

Volume 25; Issue 3

1

Experimental investigation of 355nm Nd:YAG laser ablation of RCC in PCB

Yung, Winco K.C., Liu, J.S., Man, H.C.

Journal:

Année:

1999

Langue:

english

Fichier:

PDF, 146 KB

english, 1999

2

Performance and reliability issues for a graphite based direct metalization process

Carano, Michael

Journal:

Année:

1999

Langue:

english

Fichier:

PDF, 79 KB

english, 1999

3

Manufacture of high density interconnection substrates by co‐lamination of inner layers and programmed interconnection joining layers

Fjelstad, Joseph, Karavakis, Konstantine, Haba, Belgacem

Journal:

Année:

1999

Langue:

english

Fichier:

PDF, 82 KB

english, 1999

4

Conductive filament formation failure in a printed circuit board

Rogers, Keith, Hillman, Craig, Pecht, Michael, Nachbor, Suzanne

Journal:

Année:

1999

Langue:

english

Fichier:

PDF, 133 KB

english, 1999

5

Gold and aluminum wire bonding to palladium surface finishes

Fan, Chonglun, Abys, Joseph A., Blair, Alan

Journal:

Année:

1999

Langue:

english

Fichier:

PDF, 477 KB

english, 1999

6

Solder failure mechanisms in single‐sided insertion‐mount printed wiring boards

Hillman, C., Rogers, K., Dasgupta, A., Pecht, M., Dusek, R., Lorence, B.

Journal:

Année:

1999

Langue:

english

Fichier:

PDF, 391 KB

english, 1999