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Volume 682

MRS Proceedings

Volume 682

1

Fundamental Study on Adhesion of Epoxy Underfill Materials with Passivation Layer in Flip-chip Packaging

Luo, Shijian, Wong, C. P.

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 243 KB

english, 2001

2

Using the Surface Potential Decay Method to probe electrical conduction in epoxy resins used for packaging

Sylvestre, Alain, Gonon, Patrice, Teysseyre, Jérôme, Prior, Christophe

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 87 KB

english, 2001

3

Fatigue Processes in Silicon MEMS Devices

Renuart, Emily D., Fitzgerald, Alissa M., Kenny, Thomas W., Dauskardt, Reinhold H.

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 696 KB

english, 2001

4

Mechanical Bending Fatigue Reliability and Its Application to Area Array Packaging

Skipor, Andrew F., Leicht, Larry

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 210 KB

english, 2001

5

Estimation of the Interfacial Fracture Energy of Metal/Polymer System in Microelectronic Packaging

Song, J.Y., Yu, Jin

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 109 KB

english, 2001

6

Dielectric Properties and Morphology of Ferroelectric Ceramic-Polymer Composite Films

Chiang, C. K., Popielarz, R., Sung, L. P.

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 240 KB

english, 2001

7

Effects of hydrothermal aging on the dielectric properties of epoxy molding compounds

Gonon, Patrice, Sylvestre, Alain, Teysseyre, Jérôme, Prior, Christophe

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 290 KB

english, 2001

8

Effect of Composition and Bead Settling on Debonding of Underfill Layers

Wang, Lorraine C., Dauskardt, Reinhold H.

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 1004 KB

english, 2001

9

Underfill Encapsulant Flow Measured using Capacitance Measurement Techniques

Driscoll, T. E., Lehmann, G. L., Cotts, E. J.

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 223 KB

english, 2001

10

Microthermomechanical Analysis of Lead-Free SN-3.9AG-0.6CU Alloys; Part I : Viscoplastic Constitutive Properties

Haswell, Peter, Dasgupta, Abhijit

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 2.78 MB

english, 2001

11

Characterization and Soldering of Organic Modified Aluminum Thin Films and Bond Pads

Fang, Rui, Dahlgren, Eric, O'Keefe, Matthew J., O'Keefe, Thomas J., Shih, Wu-Sheng, Gamota, Daniel R., Zhang, Jie

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 1.93 MB

english, 2001

12

Mechanical Properties and Fracture Behavior of the Cu and Cu6Sn5–Dispersed Sn-Pb Solder Bumps Processed by Screen Printing

Cha, Ho-Seob, Lee, Kwang-Eung, Choi, Jin-Won, Oh, Tae-Sung

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 97 KB

english, 2001

13

New Stepped Process and Materials for Chip Bonding Technology on Non-rigid and Flexible Substrates

Park, Sung Kyu, Han, Jeong In, Kim, Won Keun, Kwak, Min Gi

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 432 KB

english, 2001

14

Packaging for a Sensor Platform Embedded in Concrete

Cain, Russell Paul, Carkhuff, Bliss G., Srinivasan, R., Grossman, Kenneth R., Weiskopf, Frank

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 562 KB

english, 2001

15

Material System for Packaging 500°C SiC Microsystems

Chen, Liang-Yu, Okojie, Robert S., Neudeck, Philip G., Hunter, Gary W., T. Lin, Shun-Tien

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 1.65 MB

english, 2001

16

Carrier-Level Packaging and Reliability of a MEMS-Based Safety and Arming Device

Deeds, Michael, Cochran, Kevin, Swaminathan, Rajesh, Sandborn, Peter

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 2.16 MB

english, 2001

17

Implementation of a low temperature wafer bonding process for acceleration sensors

Wiemer, Maik, Otto, Thomas, Gessner, Thomas, Hiller, Karla, Kapser, Konrad, Seidel, Helmut, Bagdahn, Joerg, Petzold, Matthias

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 914 KB

english, 2001

18

Novel Materials and Joinings for Power Electronics Module Packaging

Wolfgang, Eckhard, Mitic, Gerhard, Lefranc, Guy, Schwarzbauer, Herbert

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 739 KB

english, 2001

19

A Dimple-Array Interconnect Technique for Power Semiconductor Devices

Wen, Simon S., Huff, Daniel, Lu, Guo-Quan

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 373 KB

english, 2001

20

An Investigation of Lead Free and Bromine Free Technologies for Medium Power Semiconductor Packaging

Adamson, Philip, Dugdale, Pamela

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 537 KB

english, 2001

21

Investigation of Mechanical Stresses in Underlying Silicon due to Lead-Tin Solder Bumps via Synchrotron X-Ray Topography and Finite Element Analysis

Kanatharana, J., Pérez-Camacho, J.J., Buckley, T., McNally, P.J., Tuomi, T., Danilewsky, A.N., O'Hare, M., Lowney, D., Chen, W.

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 163 KB

english, 2001

22

Adhesion Mechanisms of Silane Adhesion Promoters in Microelectronic Packaging

Jenkins, Maura, Snodgrass, Jeffrey, Chesterman, Aaron, DeVries, Gretchen, Dauskardt, Reinhold H., Bravman, John C.

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 32 KB

english, 2001

23

High Tg, Low Dielectric Constant Aromatic Benzoxazoles Containing Allylether Pendent Groups for Use in Microelectronic Packaging

Alexander, Max D., Dang, Thuy D., Specker, Christina E., Houtz, Marlene, Spry, R.J., Arnold, Fred E.

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 54 KB

english, 2001