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Volume 516

MRS Proceedings

Volume 516

1

Statistical Evaluation of Stressmigration Reliability in Al-Cu Interconnects

Jawarani, D., Gall, M., Capasso, C., Müller, J., Hernandez, R., Kawasaki, H.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 925 KB

english, 1998

2

Modelling of Heat Conduction and Thermal Stresses in Multilevel Interconnects

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 812 KB

english, 1998

3

The Effects of Microstructures on Normal and Early Failures of Interconnects Caused by Electromigration

Liu, Yongkun, Diefendorf, R. J.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 369 KB

english, 1998

4

Thermomechanical Behavior of Continuous and Patterned Al Thin Films

Kraft, O., Nix, W.D.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 2.07 MB

english, 1998

5

Electromigration Damage in Aluminum Alloys Studied by 1/ f Noise

Kruelle, C.A., Ochs, E., Stoll, H., Seeger, A., Bloom, I.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 354 KB

english, 1998

6

Local Channel Temperature Measurements on Pseudomorphic High Electron Mobility Transistors by Photoluminescence Spectroscopy

Landesman, J.P., Martin, E., Depret, B., Fily, A., Braun, P.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 394 KB

english, 1998

7

Effect of Ar Sputtering Pretreatment on the Electromigration Resistance in Al-Cu/TiN/Ti Interconnects

Wang, L.P., Chuang, A., Lin, L.T., Huang, F.S., Perng, K., Hwang, J.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 329 KB

english, 1998

8

Microstructure Evolution of Al-1.5% Cu Alloy as a Function of Resistance Change Due to Isothermal DC Stressing

Lee, T, Schade, M, Merino, A, Lee, J, Christenson, C, Varker, C, Evans, K

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 1.65 MB

english, 1998

9

Texture and Grain Boundary Structure Dependence of Hillock Formation in Thin Metal Films

Nowell, Matithew M., Field, David P.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 2.25 MB

english, 1998

10

TEM Observations on the Evolution of Grain Structure in Pressurized Al-0.5Cu Thin Films

Yang, H.D., Kim, C.-U., Saran, M., Le, H.A.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 2.21 MB

english, 1998

11

Electromigration Failure Kinetics in Al Alloy Lines: A Microstructure-Based Constitutive Equation

Kang, S. H., Morris, J. W., Kim, C.-U.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 1017 KB

english, 1998

12

Modelling Electromigration and Stress Migration Damage in Advanced Interconnect Structures

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 3.01 MB

english, 1998

13

Modelling of Failure Time Distributions for Interconnects Due to Stress Voiding and Electromigration

Wolfer, W. G., Bartelt, M. C., Dike, J. J., Hoyt, J. J., Gleixner, R. J., Nix, W. D.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 949 KB

english, 1998

14

Early Detection of the Metallization Quality Using Moderately Accelerated Electromigration Stress Conditions

Scorzoni, A., De Munari, I., Impronta, M., Balboni, R., Kelaidis, N., Foley, S., Forde, M.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 2.83 MB

english, 1998

15

Grain Structure Statistics in As-Patterned and Annealed Interconnects

Fayad, W., Andleigh, V., Thompson, C. V., Frost, H.J.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 348 KB

english, 1998

16

Analysis of Failure in Metallic Thin-Film Interconnects Due to Stress and Electromigration-Induced Void Propagation

Rauf Gungor, M., Gray, Leonard J., Maroudas, Dimitrios

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 1.53 MB

english, 1998

17

Model for Estimation of Metallization Lifetime Including Electromigration and Thermo-Mechanical Stress Relaxation

Roloff, Herbert F., Fellinger, Johannes

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 1.90 MB

english, 1998

18

Defect Generation and Diffusion Mechanisms in Al and Al-Cu

Liu, C. - L., Liu, X.-Y., Borucki, L. J.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 659 KB

english, 1998

19

Electric Field Direct Force in Electromigration Mechanism

Karpushin, A.A., Sorokin, A.N., Baklanov, M.R., Maex, K.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 252 KB

english, 1998

20

The Stress Change in Passivated Al Lines Due to the Reaction Between Ti and Al

Marieb, T., Mack, A., Lee, J., Dibattista, M.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 891 KB

english, 1998

21

Determination of the Effects of Strain on Electrical Resistivity in Patterned Interconnects

Sanchez, John E., Reilly, Christopher J.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 1.31 MB

english, 1998

22

Critical Length and Resistance Saturation Effects in Al(Cu) Interconnects

Gall, M., Müller, J., Jawarani, D., Capasso, C., Hernandez, R., Kawasaki, H.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 476 KB

english, 1998

23

Stress- and Electromigration-Induced Voiding and Its Correlation to Macroscopic Stress Changes

Schroeder, Herbert

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 3.68 MB

english, 1998

24

The Effects of Passivation Thickness and Initial Aluminum Line Stress on Electromigration Behavior

Lee, Samantha, Bravman, John C., Flinn, Paul A., Marieb, Tom N.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 1.80 MB

english, 1998

25

Measuring Local Strain Variations Full-Field in Photoresist Thin Films Using Photolithographic Dot Arrays

Lin, P.P., Rowlands, R. E.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 734 KB

english, 1998

26

Copper Versus Magnesium as an Alloying Element in Aluminum Interconnects: Effects on Electromigration

Spolenak, R., Mason, J., Kraft, O., Arzt, E.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 1.20 MB

english, 1998

27

Investigations of Electromigration Failure by Electrical Measurement and Scanning Probe Microscopy With Additional Simulation

Fabricius, Alexander, Breternitz, Volkmar, Knedlik, Christian, Henning, Andreas, Liebscher, Eckhard, Vogel, Silvia

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 763 KB

english, 1998

28

Electromigration and Diffusion in Short Al-Ni-Cr Lines

Jacobs, L.C., Verbruggen, A.H., Kalkman, A.J., Radelaar, S.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 423 KB

english, 1998

29

The Electromigration of CVD-Copper and PVD-Copper Polycrystalline Lines

Kim, Seok, Choi, Doo-Jin

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 2.78 MB

english, 1998

30

Deformation Mechanisms in Thin Cu Films

Baker, Shefford P., Keller, Rose-Marie, Kretschmann, André, Arzt, Eduard

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 1.03 MB

english, 1998

31

Effect of Poly-Si on Electromigration Behaviors and Microstructure Characteristics of Au Metallization

Lee, T., York, B.R., Lindgren, B., Kentzinger, H., Lee, J., Christenson, C., Varker, C., Evans, K.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 1.01 MB

english, 1998

32

Evaluation of the Electromigration Performance of New Aluminium Via Plug-Fill Techniques for 0.25μm and 0.18μm Technologies

Foley, S., Chan Tung, N., Gounelle, C., Wyborn, G., Louwers, S., Mathewson, A.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 2.54 MB

english, 1998

33

Cracking and Debonding in Integrated Microstructures

Liu, X.H., Suo, Z., Ma, Q., Fujimoto, H.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 1.12 MB

english, 1998

34

Effect of Thermal Treatment on the Hardness and Fracture Toughness of Sputter Deposited Bi-Layered Thin Films on Silicon

Manoharan, M., Narayanan, B., Muralidharan, G.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 802 KB

english, 1998

35

Quantitative Measure of EM-Induced Drift in Sub-Micron Al Lines

Witt, C., Volkert, C.A.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 1.48 MB

english, 1998

36

Channel Cracking Technique for Toughness Measurement of Brittle Dielectric Thin Films on Silicon Substrates

Ma, Qing, Xie, Joseph, Chao, Sam, El-Mansy, Safaa, Mcfadden, Robert, Fujimoto, Harry

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 1.25 MB

english, 1998

37

On the Interaction Between Indentation Cracks on Metallized Silicon

Manoharan, M., Muralidharan, G.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 708 KB

english, 1998

38

FEM Analysis of Thermal Stresses in Advanced Electronic Packages

Rzepka, Sven, Korhonen, Matt A., Li, Che-Yu, Meusel, Ekkehard

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 3.24 MB

english, 1998

39

The Reliability Assessment of Flip Chip Type Solder Joints Based on the Damage Integral Approach

Su, Peng, Zhou, Chen, Rzepka, Sven, Korhonen, Matt, Li, Che-Yu

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 281 KB

english, 1998

40

In-Situ X-ray Photoemission Spectromicroscopy of Electromigration in Patterned Al-Cu Lines With Maximum

Solak, H.H., Lorusso, G.F., Singh, S., Cerrina, F., Underwood, J.H., Batson, P.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 812 KB

english, 1998

41

Interface Effect on the Transverse Thermal Conductivity of SiO2 Films Deposited on Silicon

Zhao, W., Brotzen, F. R., Hehn, L., Loos, P. J.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 1.23 MB

english, 1998

42

Novel Electromigration Failure Mechanism for Aluminium-Based Metallization on Titanium Substrate

Girardi, G., Caprile, C., Cazzaniga, F., Riva, L.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 2.04 MB

english, 1998

43

Diffusion and Electromigration of Cu in Single Crystal Al Interconnects

Srikar, V. T., Thompson, C. V.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 202 KB

english, 1998

44

Segregation of Cu on Etched and Non-Etched Al(Cu) Surface

Li, Hua, Maex, Karen, Brijs, Bert, Conard, Thierry, Vandervorst, Wilfried, Baklanov, Michael, Boullart, Werner, Froyen, Ludo

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 411 KB

english, 1998

45

A Quantitative Study of Void Nucleation Times in Passivated Aluminum Interconnects

Doan, Jonathan C., Bravman, John C., Flinn, Paul A., Marieb, Thomas N.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 2.90 MB

english, 1998

46

Electromigration-Induced Drift in Damascene vs. Conventional Interconnects: An Intrinsic Difference

Proost, J., Samajdar, I., Witvrouw, A., Maexo, K.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 394 KB

english, 1998

47

Evolution of the Electrical Properties of Interconnects Under Electromigration Stress

Jones, B.K., Guo, Jianping, Xu, Yanzhong, Trefan, G.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 270 KB

english, 1998

48

Grain Growth by Digm in Ni Thin Film Under High Tensile Stress

Jia, Zhengyi, Pan, G. Z., Tu, K. N.

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 1.05 MB

english, 1998

49

Dependence of Stress-Related Reliability of Metallic Power Line on Physical Properties of Its Overlayer, Chip Location and Package Structure in Memory Devices

Journal:

MRS Proceedings

Année:

1998

Langue:

english

Fichier:

PDF, 2.59 MB

english, 1998