Laser singulation of thin wafer: Die strength and surface roughness analysis of 80 μm silicon dice
Nitin Sudani, Krishnan Venkatakrishnan, Bo TanVolume:
47
Année:
2009
Langue:
english
Pages:
5
DOI:
10.1016/j.optlaseng.2009.01.009
Fichier:
PDF, 869 KB
english, 2009