A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect
Robin C.J. Wang, C.C. Lee, L.D. Chen, Kenneth Wu, K.S. Chang-LiaoVolume:
46
Année:
2006
Langue:
english
Pages:
6
DOI:
10.1016/j.microrel.2006.07.053
Fichier:
PDF, 768 KB
english, 2006