Synergistic modulation of electrical and thermal properties of Cu1.8S bulk materials via nanostructuring and band engineering
Gu, Shi-Wei, Qin, Peng, Zhang, Yi-Xin, Guo, Jun, Shan, Quan, Feng, Jing, Ge, Zhen-HuaVolume:
852
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2020.156972
Date:
January, 2021
Fichier:
PDF, 548 KB
2021