Mechanistic study of copper wire-bonding failures on packaging devices in acidic chloride environments
Ross, Nick, Asokan, Muthappan, Ashok Kumar, Goutham Issac, Caperton, Joshua, Alptekin, John, Salunke, Ashish Shivaji, Chyan, Oliver M.Volume:
113
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2020.113917
Date:
October, 2020
Fichier:
PDF, 2.79 MB
2020
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