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[IEEE 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Reno, NV, USA (2020.7.28-2020.8.28)] 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Effects of Various Via Patterns on Resonance and Crosstalk in High Speed Printed Circuit Boards
Park, IL-Young, Ahmed, Iftikhar, Brunker, David, Xie, Pu, Natarajan, JayanthiAnnée:
2020
DOI:
10.1109/emcsi38923.2020.9191554
Fichier:
PDF, 1.23 MB
2020