Effect of Active Al on the Microstructure and Mechanical Properties of a Mo/Sn-Based Solder Interface: First-Principles Calculation and Experimental Study
Liu, Hao, Guo, Weibing, Xue, Haitao, Zhang, XiaomingJournal:
Journal of Electronic Materials
DOI:
10.1007/s11664-020-08429-8
Date:
August, 2020
Fichier:
PDF, 2.25 MB
2020
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