Effect of microalloying on the creep strength and microstructure of an eutectic Sn-Pb solder alloy
Noboru Wade, Tatsuo Akuzawa, Seiji Yamada, Daigo Sugiyama, Ick-Soo Kim, Kazuya MiyaharaVolume:
28
Année:
1999
Langue:
english
Pages:
4
DOI:
10.1007/s11664-999-0169-9
Fichier:
PDF, 333 KB
english, 1999