Impression Creep of a Lead-Free Sn-1.7Sb-1.5Ag Solder Reinforced by Submicron-Size Al2O3Particles
M. Kangooie, R. Mahmudi, A.R. GeranmayehVolume:
39
Langue:
english
Pages:
8
DOI:
10.1007/s11664-009-0971-4
Date:
February, 2010
Fichier:
PDF, 521 KB
english, 2010