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Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging
Moon Gi Cho, Kyung Wook Paik, Hyuck Mo Lee, Seong Woon Booh, Tae-Gyu KimVolume:
35
Année:
2006
Langue:
english
Pages:
6
DOI:
10.1007/s11664-006-0181-2
Fichier:
PDF, 517 KB
english, 2006