Facile approach to mitigate thermal issues in 3D IC integration using effective FIN orientation
Rakesh, Banothu, Mahindra, Kailaas, Sai Venkat Goud, Marri, Arun Vignesh, N., Padma, Tatiparti, Kumar Panigrahy, AsisaJournal:
Materials Today: Proceedings
DOI:
10.1016/j.matpr.2020.03.663
Date:
May, 2020
Fichier:
PDF, 1.18 MB
2020
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