
Characterization of Nanoscopic Cu/Diamond Interfaces Prepared by Surface Activated Bonding: Implications for Thermal Management
Liang, Jianbo, Ohno, Yutaka, Yamashita, Yuichiro, Shimizu, Yasuo, Kanda, Shinji, Kamiuchi, Naoto, Kim, Seongwoo, Koji, Koyama, Nagai, Yasuyoshi, Kasu, Makoto, Shigekawa, NaoteruLangue:
english
Journal:
ACS Applied Nano Materials
DOI:
10.1021/acsanm.9b02558
Date:
February, 2020
Fichier:
PDF, 1.44 MB
english, 2020