[IEEE 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Cluj-Napoca, Romania (2019.10.23-2019.10.26)] 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Education 4.0 â Jump to Innovation with IoT in Higher Education
Ciolacu, Monica Ionita, Binder, Leon, Svasta, Paul, Tache, Ioan, Stoichescu, DanAnnée:
2019
Langue:
english
DOI:
10.1109/SIITME47687.2019.8990825
Fichier:
PDF, 2.26 MB
english, 2019