[IEEE 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) - Sapporo, Japan (2019.6.3-2019.6.7)] 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) - Accurate RFI prediction of 3D non-planar connector with half magnetic dipole pattern
Zhang, Ling, Huang, Qiaolei, Su, Xiangrui, Pai, Deepak, Rajagopalan, Jagan, Gaikwad, Amit, Hwang, Chulsoon, Fan, JunAnnée:
2019
Langue:
english
DOI:
10.23919/EMCSapporo/APEMC44270.2019.8976328
Fichier:
PDF, 272 KB
english, 2019
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