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Thermal behaviour of hydroxymethyl compounds as models for adhesive resins
K. Siimer, P. Christjanson, T. Kaljuvee, T. Pehk, I. SaksVolume:
97
Langue:
english
Pages:
8
DOI:
10.1007/s10973-009-0218-x
Date:
August, 2009
Fichier:
PDF, 489 KB
english, 2009