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Non-destructive Evaluation of Adhesive Bonding Using Reflective Fringe Pattern Technique
Fiona W. Y. Chan, T. W. YeungVolume:
27
Langue:
english
Pages:
10
DOI:
10.1007/s10921-008-0038-0
Date:
December, 2008
Fichier:
PDF, 1012 KB
english, 2008