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[AIP Stress-induced phenomena in metallization: Second international workshop - Austin, Texas (USA) (29−31 Mar 1993)] AIP Conference Proceedings - Electromigration reliability of AlCu interconnects with W studs
Rathore, H. S., Filippi, R. G., Wachnik, R. A., Estabil, J. J., Kwok, T.Volume:
305
Année:
1994
DOI:
10.1063/1.45707
Fichier:
PDF, 1.09 MB
1994