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Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application
K. L. Chan, M. Mariatti, Z. Lockman, L. C. SimVolume:
21
Langue:
english
Pages:
7
DOI:
10.1007/s10854-009-9991-3
Date:
August, 2010
Fichier:
PDF, 667 KB
english, 2010