[IEEE 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - New Orleans, LA, USA (2019.7.22-2019.7.26)] 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - Accurate Socket Modeling And Validation For SI/PI Applications Considering Contact Resistance
Wang, Tao, Sriboonlue, Varin, Ozbayat, Selman, Romo L., Gerardo, Shin, Jaemin, Michalka, TimAnnée:
2019
DOI:
10.1109/isemc.2019.8825282
Fichier:
PDF, 5.14 MB
2019