[IEEE 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) - Sapporo, Japan (2019.6.3-2019.6.7)] 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) - Design and Analysis of Flexible Interconnects on an Extremely Thin Silicon Substate for Flexible Wearable Devices
Jeong, Seungtaek, Kim, Subin, Kim, Youngwoo, Park, Shinyoung, Park, Hyunwook, Kim, Joungho, Lee, Jae Hak, Song, Jun YeobAnnée:
2019
DOI:
10.23919/EMCTokyo.2019.8893905
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2019
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