[IEEE 2019 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2019.10.22-2019.10.24)] 2019 International Wafer Level Packaging Conference (IWLPC) - Novel Temporary Bonding and Debonding Solutions Enabling an Ultrahigh Interonnect Density Fo-Wlp Structure Assembly with Quasi-Zero Die Shift
Podpod, Arnita, Miller, Andy, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Liu, Xiao, Wu, Qi, Yess, Kim, Arnold, Kim, Phommahaxay, Alain, Bex, Pieter, Kennes, Koen, Bertheau, Julien, Arumugam, HariharAnnée:
2019
DOI:
10.23919/IWLPC.2019.8914144
Fichier:
PDF, 656 KB
2019