[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - SiC-SiC temporary bonding compatible with rapid thermal annealing at 1000 °C
Mu, Fengwen, Suga, Tadatomo, Uomoto, Miyuki, Shimatsu, Takehito, Iguchi, Kenichi, Nakazawa, HaruoAnnée:
2019
Langue:
english
DOI:
10.23919/LTB-3D.2019.8735291
Fichier:
PDF, 217 KB
english, 2019