[IEEE 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Wroclaw, Poland (2019.5.15-2019.5.19)] 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Process Optimization of Foil-Based Transient Liquid Phase Bonding for Die Attachment
Feisst, Markus, Kustermann, Jan, Schumacher, Axel, Spies, Irina, Wilde, JurgenAnnée:
2019
Langue:
english
DOI:
10.1109/isse.2019.8810295
Fichier:
PDF, 1.05 MB
english, 2019