[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - Thermo-Mechanical Process Emulation and Sensitivity Analysis of Wafer Warpage after Reconstitution in Fan-out Packaging
Yang, Cheng-Ying, Chen, Kuo-Shen, Yang, Tian-Shian g, Chiu, Tz-Cheng, Ho, Ching-JenqAnnée:
2019
Langue:
english
DOI:
10.23919/icep.2019.8733604
Fichier:
PDF, 2.95 MB
english, 2019