Effects of 2,2-Dithiodipyridine as a Leveler for Through-Holes Filling by Copper Electroplating
Wang, Xu, Zhang, Shengtao, Chen, Shijin, Tan, Bochuan, Guo, Hailiang, Wang, Ya, Qiang, Yujie, Fu, Shulei, Wen, YananVolume:
166
Année:
2019
Langue:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/2.0461913jes
Fichier:
PDF, 1.59 MB
english, 2019