[IEEE 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) - Berlin, Germany (2019.6.23-2019.6.27)] 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) - Shape Memory Foil-Based Active Micro Damping for Portable Applications
Jacob, Kiran, Ahmadi, Shahabeddin, Wendler, Frank, Miyazaki, Shuichi, Gueltig, Marcel, Kohl, ManfredAnnée:
2019
Langue:
english
DOI:
10.1109/TRANSDUCERS.2019.8808494
Fichier:
PDF, 1.17 MB
english, 2019
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