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[IEEE 2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) - Lausanne, Switzerland (2019.7.15-2019.7.18)] 2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) - Charge-Based Model for Reliability Analysis Flow of Flip- Flops under Process Variation and Aging
Taddiken, Maike, Paul, Steffen, Peters-Drolshagen, DagmarAnnée:
2019
Langue:
english
DOI:
10.1109/smacd.2019.8795260
Fichier:
PDF, 761 KB
english, 2019