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[IEEE 2019 IEEE European Test Symposium (ETS) - Baden-Baden, Germany (2019.5.27-2019.5.31)] 2019 IEEE European Test Symposium (ETS) - Test Solutions for High Density 3D-IC Interconnects - Focus on SRAM-on-Logic Partitioning
Jani, Imed, Lattard, Didier, Vivet, Pascal, Durupt, Jean, Thuries, Sebastien, Beigne, EdithAnnée:
2019
Langue:
english
DOI:
10.1109/ETS.2019.8791531
Fichier:
PDF, 648 KB
english, 2019