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Growth Characterization of intermetallic compounds at the Cu/Al solid state interface
Ma, Hengbo, Ren, Kexu, Xiao, Xiao, Qiu, Ranfeng, Shi, HongxinJournal:
Materials Research Express
DOI:
10.1088/2053-1591/ab3171
Date:
July, 2019
Fichier:
PDF, 694 KB
2019