[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Plastic deformation and failure modes of moulding compounds during indentation loading and their importance for the quantitative characterisation of adhesion
Pflugler, Nadine, Reuther, Georg M., Goroll, Michael, Pufall, Reinhard, Wunderle, BernhardAnnée:
2019
Langue:
english
DOI:
10.1109/EuroSimE.2019.8724566
Fichier:
PDF, 674 KB
english, 2019