Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Embedded Multi-die Interconnect Bridge (EMIB)
Keser, Beth, Kroehnert, SteffenVolume:
10.1002/97
Année:
2019
Langue:
english
DOI:
10.1002/9781119313991.ch23
Fichier:
PDF, 543 KB
english, 2019