
[IEEE 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA (2018.10.14-2018.10.17)] 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Thermal-Power Delivery Network Co-Analysis for Multi-Die Integration
Obaidul Hossen, Md, Zhang, Yang, Bakir, Muhannad S.Année:
2018
Langue:
english
DOI:
10.1109/EPEPS.2018.8534267
Fichier:
PDF, 617 KB
english, 2018