Pressureless Silver Sintering on Nickel for Power Module Packaging
Wang, Meiyu, Mei, Yunhui, Li, Xin, Burgos, Rolando, Boroyevich, Dushan, Lu, Guo-QuanAnnée:
2019
Journal:
IEEE Transactions on Power Electronics
DOI:
10.1109/TPEL.2019.2893238
Fichier:
PDF, 5 KB
2019