[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Simulation and Low Cost Process Development of Thin Wafer Level TSV Last Integration Scheme for RF Applications
Rahim, Md Kaysar, England, Luke, Wang, Yeye, Yu, Daquan, Wang, TengAnnée:
2018
Langue:
english
DOI:
10.1109/ICEPT.2018.8480479
Fichier:
PDF, 5.67 MB
english, 2018