An integrated system for setting the optimal parameters in IC chip-package wire bonding processes
Tung-Hsu Hou, Shyh-Huei Chen, Tzu-Yu Lin, Kun-Ming HuangVolume:
30
Langue:
english
Pages:
7
DOI:
10.1007/s00170-005-0083-0
Date:
September, 2006
Fichier:
PDF, 172 KB
english, 2006