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[IEEE 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) - Melaka (2018.9.4-2018.9.6)] 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) - Assessment Methodology on Mold Void Defect by Scanning Acoustic Microscopy (SAM) Non-Destructive Technique
Soon Kiong, Eric Wong, Lai, Chin YungAnnée:
2018
Langue:
english
DOI:
10.1109/IEMT.2018.8511798
Fichier:
PDF, 426 KB
english, 2018