[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - A Numerical Model for Joule heating in Sn Solder Balls of Two Different Sizes
Kunwar, Anil, Shang, Shengyan, Raback, Peter, Song, Xueguan, Malla, Prafulla Bahadur, Wang, Yunpeng, Ma, HaitaoAnnée:
2018
Langue:
english
DOI:
10.1109/ICEPT.2018.8480595
Fichier:
PDF, 5.89 MB
english, 2018