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[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Mechanism of Solder Joint Intermittent Faults and Its Detection
Huakang, Li, Yong, Zhang, Peng, Yang, Mingjiang, Ji, Guanjun, LiuAnnée:
2018
Langue:
english
DOI:
10.1109/ipfa.2018.8452542
Fichier:
PDF, 631 KB
english, 2018