[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - The influence of sintering process on thermal properties of nano-silver paste
Lu, Xiuzhen, Ke, Wei, Zhou, Cheng, Wu, Yanpei, Zhang, Qiaoran, Huang, Shirong, Xia, Weijuan, Ye, Lilei, Zehri, Abdelhafid, Liu, JohanAnnée:
2018
Langue:
english
DOI:
10.1109/ICEPT.2018.8480545
Fichier:
PDF, 2.06 MB
english, 2018